Main Topics
Pick & Place
Product Component Handling
In order to achieve full automation of the production, handling and transport systems are required…
Gecko technology – A new gripper generation?
New scientific developments in material sciences makes it possible to achieve attachment systems, which are…
Pin Transfer of Solder Paste and Pick & Place of SMD components on PCB
The process in Vid. 1 is conducted on a standard machine using standard components of…
Dispensing solder paste, pick & place LED modules and micro laser soldering on a 3D-MID substrate
Dispensing solder paste and pick & place LED modules on a 3D substrate (3D MID)…
Determination of the Placing Accuracy
In order to determine the placing accuracy, special glass components with applied, highly accurate patterns…
Dispensing solder paste and SMD adhessives on a 3D-MID
Applying micro assembly processes on a 3D-MID substrate is a challenging task. The video shows…
Dispensing
Dispensing and Curing of Adhesives
Bonding optical components mainly requires adhesives with suitable optical properties. Due to small dimensions and…
Jet-Dispensing basics
The combination of special jet valves and a well defined feed pressure on the dispensing…
Requirements for Direct Dispensing
The following statements and their detailed explanations should facilitate the selection of suitable dispensing materials.…
Things to Know for Good Direct Dispensing
A dispensible substance is provided at a defined height on a structurablesurface (film). The substance…
Direct Dispensing
Direct dispensing is used to apply fluid and jellylike substances directly at the component which…
Jet Dispensing – An Overview
Jet-Dispensing, Jetting or pulsing means the application of dispensing media (adhesive, underfill, coating, etc.) by…
Pin Transfer of Solder Paste and Pick & Place of SMD components on PCB
The process in Vid. 1 is conducted on a standard machine using standard components of…
Dispensing solder paste, pick & place LED modules and micro laser soldering on a 3D-MID substrate
Dispensing solder paste and pick & place LED modules on a 3D substrate (3D MID)…
Dispensing in Micro Assembly Industry
The dispensing of substances is one of the core technologies of the micro assembly industry.…
Available Devices for Direct Dispensing
In Order to realise direct dispensing, Häcker Automation has developed the direct dispensing unit DDU,…
Dispensing solder paste and SMD adhessives on a 3D-MID
Applying micro assembly processes on a 3D-MID substrate is a challenging task. The video shows…
Soldering
Guidelines for pad design on PCB for laser soldering processes
In order to achieve high-quality results from a selective soldering process some issues has to…
Variation of laser spot size for correct soldering of SMD components
Using a laser for the selective soldering of SMD components can be provide high quality…
Dispensing solder paste, pick & place LED modules and micro laser soldering on a 3D-MID substrate
Dispensing solder paste and pick & place LED modules on a 3D substrate (3D MID)…