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Pick & Place

Product Component Handling

In order to achieve full automation of the production, handling and transport systems are required…

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Gecko technology – A new gripper generation?

New scientific developments in material sciences makes it possible to achieve attachment systems, which are…

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Pin Transfer of Solder Paste and Pick & Place of SMD components on PCB

The process in Vid. 1 is conducted on a standard machine using standard components of…

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Dispensing solder paste, pick & place LED modules and micro laser soldering on a 3D-MID substrate

Dispensing solder paste and pick & place LED modules on a 3D substrate (3D MID)…

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Determination of the Placing Accuracy

In order to determine the placing accuracy, special glass components with applied, highly accurate patterns…

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Dispensing solder paste and SMD adhessives on a 3D-MID

Applying micro assembly processes on a 3D-MID substrate is a challenging task. The video shows…

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Dispensing

Dispensing and Curing of Adhesives

Bonding optical components mainly requires adhesives with suitable optical properties. Due to small dimensions and…

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Jet-Dispensing basics

The combination of special jet valves and a well defined feed pressure on the dispensing…

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Requirements for Direct Dispensing

The following statements and their detailed explanations should facilitate the selection of suitable dispensing materials.…

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Things to Know for Good Direct Dispensing

A dispensible substance is provided at a defined height on a structurablesurface (film). The substance…

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Pin Transfer of Solder Paste and Pick & Place of SMD components on PCB

The process in Vid. 1 is conducted on a standard machine using standard components of…

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Dispensing solder paste, pick & place LED modules and micro laser soldering on a 3D-MID substrate

Dispensing solder paste and pick & place LED modules on a 3D substrate (3D MID)…

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Dispensing in Micro Assembly Industry

The dispensing of substances is one of the core technologies of the micro assembly industry.…

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Available Devices for Direct Dispensing

In Order to realise direct dispensing, Häcker Automation has developed the direct dispensing unit DDU,…

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Dispensing solder paste and SMD adhessives on a 3D-MID

Applying micro assembly processes on a 3D-MID substrate is a challenging task. The video shows…

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Soldering

Guidelines for pad design on PCB for laser soldering processes

In order to achieve high-quality results from a selective soldering process some issues has to…

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Variation of laser spot size for correct soldering of SMD components

Using a laser for the selective soldering of SMD components can be provide high quality…

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Dispensing solder paste, pick & place LED modules and micro laser soldering on a 3D-MID substrate

Dispensing solder paste and pick & place LED modules on a 3D substrate (3D MID)…

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